Solder fatigue will be predicted using Sherlock software under thermal cycling, random vibration, and shock loads.

Key Highlights:

• • • Sherlock software has most standard electronic parts built-in, along with their properties required for structural and fatigue analysis.
    • Ansys Sherlock was used to predict fatigue damage and reliability for all electronic components in the PCBs.
    • Thermal Cycling Load:
      • Thermal cycling leads to solder fatigue in the PCBA assembly. The fatigue performance of solder joints is significantly influenced by PCB board properties, thermal stresses, and package dimensions. Repeated temperature cycling causes strain accumulation, which can damage solder joints.
    • Vibration Loads (PSD and Shock Load):
      • Solder fatigue caused by vibration loads in the PCBA assembly is predicted using Sherlock software. Fatigue performance of solder joints is significantly influenced by PCB board properties and stresses.